A Review on Thermal Cycling and Drop Impact Reliability of Solder Joints in Electronic Packages

Currently, the trend of miniaturization, light weight, high speed and multifunction are common in electronic assemblies, especially, for the mobile electronics. One of the most critical aspects of the package reliability is solder joint reliability. So, in that field, thermal cycling and drop/impact are the primary requirement for solder joint reliability. This paper discusses the reliability of solder joint in term of both temperature cycles load and drop/ impact load from view points of failure mode and relevant material properties. High compliance and high grain-coarsening resistance are identified as key material properties for high thermal cycling and drop impact reliability respectively. The paper details the requirements solder joints have to meet to be qualified for the mobile electronics applications. Therefore, this contribution has its value in giving information on suitable material electronic devices under different loading condition. Vpliv termičnih in fizičnih obremenitev na zanesljivost spajkanih spojev v elektronskih vezjih Kjučne besede: spajkanje, termične in fizične obremenitve, načini odpovedi, lastnosti materiala Izvleček: Miniaturizacija, zmanjševanje teže, velika hitrost in večopravilnost so trenutni trend lastnosti elektronskih vezij, še posebej namenjenih mobilnim napravam. Eden najbolj kritičnih vidikov zanesljivosti elektronskega modula je zanesljivost spajkanega spoja. Le-ta mora biti odporen na termične in fizične obremenitve. V prispevku obravnavamo zanesljivost spajkanega spoja ter vpliv materialnih lastnosti na vzroke odpovedi po termičnih in udarnih obremenitvah. Naštejemo vse zahteve, ki jih zanesljiv spoj mora zadovoljevati, da zadosti kvalitetnim kriterijem za uporabo v elektronskih modulih namenjenih mobilnim napravam.